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Victrex APTIV™ 2000-050 Polyetheretherketone (PEEK) Polymer Film, Amorphous
Categories: Polymer; Film; Thermoplastic; Polyketone; Polyetheretherketone (PEEK)

Material Notes: APTIV™ PEEK 2000 series films are unfilled amorphous films made from VICTREX™ PEEK polymer. The film provides a material solution for engineers in ultra-high performance applications.

APTIV PEEK 2000 has a unique combination of properties providing high temperature performance, light weight, mechanical strength, durability, excellent radiation, hydrolysis and chemical resistance, electrical insulation, wear and abrasion resistance, excellent barrier properties with high purity, good flammability without the use of flame retardants, low toxicity of combustion products, and low moisture absorption in a film format. Inherently halogen free and ease of processing makes APTIV films a technology enabler.

Applications:

  • Aerospace insulation
  • Electrical Insulation
  • Acoustic speaker diaphragms
  • Thermoforming of thin wall parts
  • Composites

All information provided by Victrex.

Properties measured on 50 micron film

Vendors: With over 30 years of focus, experience and security of supply Victrex Polymer Solutions is the world’s leading manufacturer of high performance Polyaryletherketones (PAEK) including versatile VICTREX™ PEEK. We work with our customers and end users to deliver technology driven solutions to meet the challenges and opportunities they face and help them to achieve new levels of cost savings, quality and performance. Visit www.victrex.com, call (800) VICTREX /1-484-342-6001, or email victrexplc@victrex.com.

Ensinger TECAPEEK™ shapes are manufactured exclusively with Victrex™ PEEK polymer. The Ensinger process and Victrex resins ensure reliability, consistency, dimensional stability, and high temperature mechanical performance.

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Physical PropertiesOriginal ValueComments
Specific Gravity 1.26 g/cc
@Temperature 23.0 °C
ISO 1183
Moisture Absorption at Equilibrium 0.21 %
@Temperature 23.0 °C,
Time 86400 sec
50% RH; ISO 62
 
Mechanical PropertiesOriginal ValueComments
Film Elongation at Break, MD >= 200 %ISO 527
 >= 200 %
@Thickness 0.0250 mm
ISO 527
 >= 200 %
@Thickness 0.0250 mm
ISO 527
Film Elongation at Break, TD >= 200 %ISO 527
 >= 200 %
@Thickness 0.100 mm
ISO 527
 >= 200 %
@Thickness 0.100 mm
ISO 527
Tensile Modulus 1.80 GPaMD; ISO 527
 1.80 GPaTD; ISO 527
 1.60 GPa
@Thickness 0.100 mm
MD; ISO 527
 1.60 GPa
@Thickness 0.100 mm
TD; ISO 527
 1.80 GPa
@Thickness 0.0250 mm
MD; ISO 527
 1.80 GPa
@Thickness 0.0250 mm
TD; ISO 527
Tear Strength 34.0 pliMD; ISO 6383-1
 34.0 pliTD; ISO 6383-1
Film Tensile Strength at Break, MD 120 MPaISO 527
 120 MPa
@Thickness 0.0250 mm
ISO 527
 130 MPa
@Thickness 0.0250 mm
ISO 527
Film Tensile Strength at Break, TD 120 MPaISO 527
 120 MPa
@Thickness 0.100 mm
ISO 527
 130 MPa
@Thickness 0.100 mm
ISO 527
 
Electrical PropertiesOriginal ValueComments
Volume Resistivity 2.00e+16 ohm-cm
@Temperature 23.0 °C
100V; ASTM D257
Dielectric Constant 3.3
@Frequency 1e+7 Hz,
Temperature 23.0 °C
Dielectric Strength 190 kV/mm
@Temperature 23.0 °C
1/4 inch electrode; ASTM D149
 120 kV/mm
@Thickness 0.100 mm
ASTM D149
 270 kV/mm
@Thickness 0.0250 mm
ASTM D149
Dielectric Breakdown 6750 V
@Thickness 0.0250 mm
ASTM D149
 9500 V
@Thickness 0.0500 mm
ASTM D149
 15000 V
@Thickness 0.100 mm
ASTM D149
Dissipation Factor 0.0030
@Frequency 1e+7 Hz,
Temperature 23.0 °C
ASTM D150
 
Thermal PropertiesOriginal ValueComments
CTE, linear 60.0 µm/m-°CMD, below Tg; ASTM D696
Shrinkage, MD <= 10 %
@Temperature 200 °C
TM-VX-84
Shrinkage, TD <= 5.0 %
@Temperature 200 °C
TM-VX-84
 
Descriptive Properties
Puncture Strength (kJ/m²)40Def Stan 81-75; 23°C

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