| Product Description: EPO-TEK® H31 is a single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and opto-electronic packaging. Advantages & Application Notes: - Bright /shiny silver provides high reflectance, especially good for enhancing LED overall brightness.
- Creamy thixotropic paste allows for high volume dispensing and pin transfer methods of application.
- Available in several different viscosity versions.
- Suggested applications:
- Semiconductor: die attach chips onto lead-frames for JEDEC Level III and II packaging. Adhesion to Ag-spot lead-frame.
- Hybrids: GaAs and Si die attach, adhesion to Au-plated chips, general electrical contacts for ceramic circuits, substrate attach to ground package.
- Opto-electronic: single LED packaging in TO-cans, LED arrays on PCB or substrate, adhesion to ITO in LCDs, and sensor device/OEM instrumentation.
- PCB/General: EMI or Rf shielding of electronics.
- Passes NASA low outgassing standard ASTM E595 with proper cure
- Long pot-life, up to 28 days, yields low waste between manufacturing shifts and avoids higher cost dry ice shipments
Information Provided by Epoxy Technology |
