- Alcohol-based, non-halide, organic-acid flux formulated for direct solder flow.
- Developed for electronic applications where halide type fluxes are not acceptable.
- Specially formulated for Nickel alloys, Kovar, EN, and Copper and other lead metals.
- Applications include IC's, and semiconductors, cerdips, and connectors.
- Conforms to IPC ANSI J-STD-004, Type ORM0.
Description: Superior No. 435 3:1 is a water-soluble flux that is entirely free of chlorides, bromides, and phosphates. It employs unique organic activators to strip off metal oxides and tarnish, without attacking the underlying metals. This flux has many of the excellent operational characteristics of halide-containing organic fluxes while being much less corrosive.Applications: COMPONENT TINNING-Superior No. 435 3:1 is supplied in an alcohol-base to assist in reducing solder-balls, and provides the most effective oxide removal as supplied. The flux may be used in dip, drag, and other processes common to component tinning. After applying flux to leads, it is recommended that soldering be done shortly after flux application. To remove post-solder residues, a water temperature of 60ºC±10ºC/140ºF±20ºF is recommended for distilled or de-ionized water. Room temperature water can be used if hot water is not available, however the cleaning cycle must be lengthened. A non-ionic surfactant may be added. Information provided by Superior Flux |
