Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound

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Aptek 2100-A/B Urethane Encapsulant and/or Potting Compound
Categories:	Polymer; Adhesive; Thermoset; Polyurethane, TS; Thermoset Polyurethane, Adhesive
Material Notes:	General purpose encapsulant and potting compound. Outstanding hydrolytic stability. Excellent adhesion to components/circuit boards. Low modulus, low stress. Field proven for military and space applications. Part A is a cloudy, unfilled polyol resin. Part B is a clear/hazy yellow organic isocyanate. Information provided by Aptek Laboratories, Inc.
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Physical Properties	Metric	English	Comments

Density	0.910 g/cc	0.0329 lb/in³	A Component; ASTM D1475
	1.23 g/cc	0.0444 lb/in³	B Component; ASTM D1475
Moisture Absorption at Equilibrium	0.18 %	0.18 %	Cured property; ASTM D570
Viscosity	50 cP	50 cP	B Component; ASTM D1824
	8000 cP	8000 cP	A Component; ASTM D1824
Outgassing - Total Mass Loss	0.38 %	0.38 %	Cured property; at 10E-6 torr; ASTM E595
Collected Volatile Condensable Material	0.030 %	0.030 %	Cured property; at 10E-6 torr; ASTM E595

Mechanical Properties	Metric	English	Comments
Hardness, Shore A	50 - 60	50 - 60	Cured property; ASTM D2240
Tensile Strength, Ultimate	3.31 MPa	480 psi	Cured property; ASTM D412
Elongation at Break	325 %	325 %	Cured property; ASTM D412
Modulus of Elasticity	0.00517 GPa	0.750 ksi	Cured property; ASTM D412
Adhesive Bond Strength	3.62 MPa	525 psi	Al-to-Al Lap Shear; Cured property; ASTM D1002

Electrical Properties	Metric	English	Comments
Volume Resistivity	8.80e+15 ohm-cm	8.80e+15 ohm-cm	Cured property; ASTM D257
Dielectric Constant	3.2 @Frequency 1000 Hz	3.2 @Frequency 1000 Hz	Cured property; ASTM D150
Dielectric Strength	14.6 kV/mm @Thickness 12.7 mm	370 kV/in @Thickness 0.500 in	Cured; ASTM D149
	>= 78.7 kV/mm @Thickness 0.127 mm	>= 2000 kV/in @Thickness 0.00500 in	Cured; ASTM D149
Dissipation Factor	0.024 @Frequency 1000 Hz	0.024 @Frequency 1000 Hz	Cured property; ASTM D150

Thermal Properties	Metric	English	Comments
CTE, linear	67.0 µm/m-°C @Temperature 20.0 °C	37.2 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 1
	220 µm/m-°C @Temperature 20.0 °C	122 µin/in-°F @Temperature 68.0 °F	Cured property; alpha 2
Thermal Conductivity	0.176 W/m-K	1.22 BTU-in/hr-ft²-°F	COLORA
Glass Transition Temp, Tg	-65.0 °C	-85.0 °F	Cured property; JMTP P200
Flash Point	>= 150 °C	>= 302 °F	B Component; ASTM D92
	>= 200 °C	>= 392 °F	A Component; ASTM D92

Processing Properties	Metric	English	Comments
Processing Temperature	80.0 °C	176 °F	Cure 8 hrs.
	100 °C	212 °F	Cure 4 hrs.

Some of the values displayed above may have been converted from their original units and/or rounded in order to display the information in a consistent format. Users requiring more precise data for scientific or engineering calculations can click on the property value to see the original value as well as raw conversions to equivalent units. We advise that you only use the original value or one of its raw conversions in your calculations to minimize rounding error. We also ask that you refer to MatWeb's terms of use regarding this information. Click here to view all the property values for this datasheet as they were originally entered into MatWeb.

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